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Semiconductor
Industry Issues: Costs
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The cost for a next-generation fab is staggering. It’s important to run a fab as efficiently and productively as possible to speed the ROI. Higher tool productivity, automated material handling, higher levels of integration, and efficient workflows all contribute to lower costs and higher yields.
We can lower the costs of ownership through:
- Higher reliability for lower maintenance and fewer repairs
- Precise operation for higher yields
- Integration of multiple technologies into high-performance subassemblies
- Simplified procurement and supply chain
- Easier assembly through smarter designs
- Application engineering assistance
We can provide custom, application-specific subassemblies, such as wafer lifts and wet bench robots to save you valuable engineering time better devoted to differentiating your strategic technologies. Plus, we’ll simplify procurement and inventory by reducing a range of components to a single part number.
Articles and Other Resource Materials
"Trade group cuts 2008 global chip sales forecast" — Global semiconductor sales won’t rise as fast as previously forecast this year as competition crimps prices, according to the most recent forecast by the Semiconductor Industry Association (SIA.)
"Using hybrid supply chains and virtual manufacturing to overcome profit and price declines" — The asset-lite manufacturing model can allow semiconductor companies to overcome profit, price, and increased expense problems and to help deliver high-performance results.
"Motion system helps shatter semiconductor packaging speed records" — The performance of an advanced, high-speed, modular motion control system from Bosch Rexroth helps Systemation Semiconductor launch a new generation of inspection and packaging machines with throughput rates of 15,000 units per hour (UPH).
"CD Metrology confidently looks beyond 32nm" — Metrology tool providers are pursuing research and workarounds to meet device makers’ CD measurement requirements, at least for another two nodes after 32nm.
"An uplifting experience" — The move to robotic wafer handling changed the way semiconductor equipment builders approached material handling in fabs. More and more frequently, they are turning to motion and control specialists to provide wafer handling systems.
"The economics of 450mm wafer transition" — Dan Hutcheson, president of VLSI Research, recently gave a wide-ranging presentation on the economics of the 450mm wafer transition, and proposed what may be a viable model for 450mm development, similar to the foundry model implemented by TSMC.
"The problems and possibilities of thin film CIGS solar cells" — Among the most promising of thin-film solar cells are those made of copper indium gallium diselenide (CIGS), but controlling film composition is a big hurdle to commercialization and industrial-level production.
"New focus on productivity, lean manufacturing" — There's plenty that can be done today to improve tool and fab productivity and delay the move to 450 mm wafer production -- that's the message from SEMI and most equipment suppliers from SEMICON West 07, according to this feature article
"The Big Debate: 450 mm or not" — Proponents of change are urging the start of research and investment in 450 mm processing tools; the alternative view is that there is still plenty that can be done to drive 300 mm economics.
"Manufacturing oriented: How semiconductor companies are moving toward higher productivity" — In a recent Motion System Design article, Bosch Rexroth semiconductor Industry expert Joel Galliher discusses a major shift in efforts to improve fab productivity and yield. The emphasis is expanding from process chambers and tool performance to encompass automation of wafer handling.
"Semiconductor fabs focus on efficient material handling" — For a condensed look at the same issues and Joel’s insight on them, go to the July 2007 Design World.
"Companies invest in DRAM and Flash capacity" — Despite falling prices for memory chips, many companies are investing in more capacity, according to latest suite of industry reports published by SEMI. Most of these companies are investing in 300 mm and memory (DRAM and Flash) production, expecting a significant increase in demand for these products.
"Energy costs drive cleanroom “green” innovations" — With the fuel price bubble refusing to burst, and public demands for industries to lighten their environmental impact, operators of cleanrooms -- which are notorious energy gluttons -- are anxious to find solutions for reducing energy consumption.
"Leisurely linear actuation" — A trip to the nanoscale worlds of semiconductors and microbiology brings tool designers to the home of nanometers — tiny units of just a millionth of a millimeter. This Motion System Design article provides tips and tools for achieving extraordinarily slow linear actuation.
"Bosch Rexroth to supply linear rail guides" — Bosch Rexroth will be providing a wide range of precision linear motion solutions for a leading semiconductor automation company with operations in both California and India.
"450 mm: A promise postponed" — Regardless of the advantages of transitioning to 450 mm wafers, a majority of the industry appears to prefer keeping tried-and-true 300 mm technology. Explore the benefits and risks of both types of manufacturing with key industry leaders.
"The future depends on an agile fab" — Mike Splinter, CEO of Applied Materials, provides an important perspective on the issues being addressed by the ISMI 300 Prime program, and how his company is responding.
"SIA sets most pessimistic semiconductor sales forecast for 2007" — It seems clear that the industry’s boom and bust business cycles are yet to be a thing of the past. This article reports the mid-year, radically reduced sales forecasts from the Semiconductor Industry Association.
"Solar panel manufacturing requirements" — This article in Cleanrooms magazine investigates the challenges of productive, profitable solar cell manufacturing, challenges quite similar to those faced by the semiconductor industry.
"2012" — It's said the year 2012 is the inevitable date to complete the transition from 300 mm to 450 mm wafer processing; this editorial by Semiconductor International Senior Editor Alexander Braun discusses why major segments of the industry are less than thrilled over the prospect.
"Manufacturing Oriented: How Semiconductor Companies Are Moving Toward Higher Productivity." (PDF-120KB) — As wafers became larger and feature widths smaller, issues like productivity, throughput, reliability, and automation have gained a much larger share of mind.
"Synopsys links test, yield tools for faster yield ramp" — Chip design software provider Synopsys Inc. has linked its automatic test pattern generation diagnostics and its yield management system to improved process yields.
"Searching for greater fab productivity with 300mm Prime" — Cycle-time reduction affords IC manufacturers the opportunity to optimize fab logistics significantly, reducing unproductive time and improving overall fab productivity.
"Applying motion control" — Toolmakers today are leaning toward partners who have “off-the-shelf” solutions as the industry continues the move from a laboratory to a production mentality.
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