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Semiconductor
Industry Issues: Reliability
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End-to-end reliability means more wafer starts, higher yields, and better throughput. It means maximizing uptime, eliminating unscheduled downtime, and ensuring tools operate flawlessly day in and day out. Beyond solving the tough challenges of materials, device structures, and processing technology, reliability is enhanced by:
- Smarter systems
- Advanced diagnostics
- Real-time monitoring
- Components and subsystems engineered for minimum maintenance, maximum reliability, and precision operation
Spec and build Bosch Rexroth products into your tools with the confidence you won’t have to think about them again. That’s because they provide world-class reliability that means years of flawless performance.
Our application expertise can help you find new ways to solve problems, simplify complex designs, and enhance reliability.
Articles and Other Resource Materials
"Using hybrid supply chains and virtual manufacturing to overcome profit and price declines" — The asset-lite manufacturing model can allow semiconductor companies to overcome profit, price, and increased expense problems and to help deliver high-performance results.
"CD Metrology confidently looks beyond 32nm" — Metrology tool providers are pursuing research and workarounds to meet device makers’ CD measurement requirements, at least for another two nodes after 32nm.
"An uplifting experience" — The move to robotic wafer handling changed the way semiconductor equipment builders approached material handling in fabs. More and more frequently, they are turning to motion and control specialists to provide wafer handling systems.
"The problems and possibilities of thin film CIGS solar cells" — Among the most promising of thin-film solar cells are those made of copper indium gallium diselenide (CIGS), but controlling film composition is a big hurdle to commercialization and industrial-level production.
"New focus on productivity, lean manufacturing" — There's plenty that can be done today to improve tool and fab productivity and delay the move to 450 mm wafer production -- that's the message from SEMI and most equipment suppliers from SEMICON West 07, according to this feature article
"The Big Debate: 450 mm or not" — Proponents of change are urging the start of research and investment in 450 mm processing tools; the alternative view is that there is still plenty that can be done to drive 300 mm economics.
"Leisurely linear actuation" — A trip to the nanoscale worlds of semiconductors and microbiology brings tool designers to the home of nanometers — tiny units of just a millionth of a millimeter. This Motion System Design article provides tips and tools for achieving extraordinarily slow linear actuation.
"Bosch Rexroth to supply linear rail guides" — Bosch Rexroth will be providing a wide range of precision linear motion solutions for a leading semiconductor automation company with operations in both California and India.
"450 mm: A promise postponed" — Regardless of the advantages of transitioning to 450 mm wafers, a majority of the industry appears to prefer keeping tried-and-true 300 mm technology. Explore the benefits and risks of both types of manufacturing with key industry leaders.
"The future depends on an agile fab" — Mike Splinter, CEO of Applied Materials, provides an important perspective on the issues being addressed by the ISMI 300 Prime program, and how his company is responding.
"Nano-mechatronics: motion control cuts system integration costs" — This article in May Control Engineering provides details on the “NewMotion” electron microscope modular motion control system being developed around the NYCe 4000 platform.
"Solar panel manufacturing requirements" — This article in Cleanrooms magazine investigates the challenges of productive, profitable solar cell manufacturing, challenges quite similar to those faced by the semiconductor industry.
"Manufacturing Oriented: How Semiconductor Companies Are Moving Toward Higher Productivity." (PDF-120KB) — As wafers became larger and feature widths smaller, issues like productivity, throughput, reliability, and automation have gained a much larger share of mind.
"Synopsys links test, yield tools for faster yield ramp" — Chip design software provider Synopsys Inc. has linked its automatic test pattern generation diagnostics and its yield management system to improved process yields.
"Searching for greater fab productivity with 300mm Prime" — Cycle-time reduction affords IC manufacturers the opportunity to optimize fab logistics significantly, reducing unproductive time and improving overall fab productivity.
"Contamination control challenges extend beyond fabs to toolmakers" — Contamination problems cropped up in Electro Scientific Industries’ first ultraviolet, laser-based link-processing offering, intended to allow its customers to manufacture advanced memory products.
"Applying motion control" — Toolmakers today are leaning toward partners who have “off-the-shelf” solutions as the industry continues the move from a laboratory to a production mentality.
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