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Semiconductor
TECHNOLOGY UPDATES
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Trade group cuts 2008 global chip sales forecast
Global semiconductor sales won’t rise as fast as previously forecast this year as competition crimps prices, particularly for memory chips, according to the most recent forecast by the Semiconductor Industry Association (SIA.) The SIA sees global chip sales gaining 4.3% to $266.6 billion in 2008, down from a growth forecast of 7.7% issued in November. This article from the June 11, 2008 edition of Information Week provides a detailed breakdown of the most recent SIA forecast, noting that slower growth for 2008 is expected, despite healthy demand for products such as mobile phones and personal computers.
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More on productivity, throughput and cost.
Using hybrid supply chains and virtual manufacturing to overcome profit and price declines
The asset-lite manufacturing model can allow semiconductor companies to overcome profit, price, and increased expense problems and to help deliver high-performance results. According to Accenture’s Scott Grant, in this recent EDN.com article, a growing number of semiconductor companies have shifted recently to an asset-lite business model, in which they hire other companies to manufacturer a growing percentage of their devices.
Asset-lite manufacturing has enormous potential to reduce capital expenditures and risk, increase agility and responsiveness to customer demand, and broaden a company’s access to additional manufacturing capabilities.
Bosch Rexroth View: Asset-lite manufacturing demonstrates the competitive value of focusing on core competencies and investing resources and capital on the technologies that provide a competitive edge.
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More on productivity, reliability, throughput and cost.
Motion system helps shatter semiconductor packaging speed records
The cost for a next-generation semiconductor assembly and test facility is staggering. One of the few ways to achieve a return on investment, especially in such a highly competitive environment, is to maximize throughput, as measured in units per hour (UPH), and to do it with equipment that takes up the smallest work area possible.
The performance of an advanced, high-speed, modular motion control system from Bosch Rexroth helps Systemation Semiconductor launch a new generation of integrated inspection and packaging machines with throughput rates of 15,000 units per hour (UPH) or four chips per second.
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More on productivity, throughput and cost.
CD Metrology confidently looks beyond 32nm
In the relentless evolution from small node to smaller node, some of metrology’s traditional standbys seem to be, if not running out of steam, beginning to redline in terms of their inspection, measurement and test capabilities.
In this recent survey article in the June 2008 Semiconductor International, Senior Editor Alexander Braun speaks with leading metrology tool providers. He reports that research and workarounds are proceeding at warp speed and, at least for another two nodes, it seems device makers’ requirements will be met.
Bosch Rexroth View: To improve productivity in fabs and ensure semiconductor manufacturers reap the full rewards of multi-billion dollar investments, tool builders need to leverage every technology available to enhance reliability and increase throughput.
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More on productivity, reliability, throughput and cost.
An uplifting experience
The move to robotic wafer handling changed the way semiconductor equipment builders approached material handling in fabs. Semiconductor equipment makers now focus on core processes that differentiate their equipment from that of competitors, while turning to motion and control specialists to provide wafer handling systems.
One example of this is described in a recent Machine Design article, highlighting how Bosch Rexroth helped design and manufacture an automated wafer lift subassembly to meet exacting stability and repeatability requirements.
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More on productivity, reliability, throughput and cost.
The economics of 450mm wafer transition
Dan Hutcheson, president of VLSI Research, one of the leading providers of strategic research for the semiconductor industry, recently gave a wide-ranging presentation on the economics of the 450mm wafer transition. This Solid State Technology article reports on several key points of interest to both fab operators and tool builders.
Hutcheson discussed lessons learned from the mishandling of the 300mm transition, why chipmakers see a need for 450mm, why equipment suppliers are reluctant to support it, and why it’s nearly impossible to predict the ROI of a 450mm wafer transition. He then proposed what may be a viable model for 450mm development, similar to the foundry model implemented by TSMC.
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More on productivity, throughput and cost.
Bosch buys ersol Solar Energy and enters photovoltaics market
Robert Bosch GmbH has acquired an initial 50.45 percent share holding in ersol Solar Energy AG, in a deal costing €546.4 million in cash. The acquisition of ersol by Bosch demonstrates how the company, parent of Bosch Rexroth, is continuing its strategic investment in the renewable energy sector.
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More on productivity, throughput and cost.
The problems and possibilities of thin film CIGS solar cells
Among the most promising of thin-film solar cells are those made of copper indium gallium diselenide (CIGS), but controlling film composition is a big hurdle to commercialization. Some companies producing CIGS solar cells have had trouble getting “good” cells consistently in commercial volumes. In this recent article in Solid State Technology, the potential for CIGS as an alternative to silicon is explored, as well as its manufacturing challenges, particularly the difficulties in moving to full-scale production.
Bosch Rexroth View: The right controls technology, combined with other CIGS sputter process improvements, can help achieve the desired goal of improved materials utilization, improved uniformity, and reduced process costs.
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More on productivity, throughput and cost.
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