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Applications
Applications
From inline reference and critical dimension metrology tools, through backend chip packaging and inspection systems, Bosch Rexroth has the technology and expertise to keep production moving. We’ve focused significant resources on solving process bottlenecks in key areas such as:

Our expertise in drive, motion and control technologies, combined with an in-depth knowledge of how to apply those technologies, uniquely positions Bosch Rexroth to solve the production challenges of the semiconductor industry.

Applications
Wafer Lift Assembly I
Wafer Lift Assembly II
Wafer Packing/Unpacking
Wet Bench Robot
CMP Brush Box
Tray Transfer
Off-Line Binner
Back-End Inspection
Metrology/Inspection
Scanning Electron Microscopy
Cleanroom Structure
Wire Bonding
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