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xxx 2011-01-25

Case Study: Precision Automation for Nanostructures: Rexroth NYCe4000 Semiconductor Controller with SERCOS III for High-Accuracy Die Bonder

Case Study: Precision Automation for Nanostructures: Rexroth NYCe4000 Semiconductor Controller

Smart Equipment Technology (SET), one of the world’s leading providers of process solutions for high-precision bonding and nanoimprint lithography, has developed its FC 300 High Force and High Accuracy Die Bonder machine, which can adapt to a large number of processes for producing microchips and optoelectric components with nanostructures.

In developing the machine, company engineers decided to use the Rexroth NYCe4000, a motion controller optimized for the semiconductor and solar industry. The scalable multi-axis control system integrates the complete control and drive hardware in one housing with a smaller footprint than an industrial PC.

Along with the motion controller, end-to-end communication via SERCOS III provides the bandwidth required for evaluating many sensor signals and translating them into motion commands in real time via a Fast Ethernet infrastructure. This technology enables short cycle times and high reliability in addition to proven real-time mechanisms.

The FC 300 incorporates process steps for contacting and packaging the integrated circuits, whereby the NYCe4000 regulates complex motion sequences and process evaluations at the touch of a button. The end result is a highly flexible machine that can be used for many different production steps.

Download the complete case study from the Bosch Rexroth Case Studies & Technical Papers web page .

For more information please visit: www.boschrexroth-us.com

 

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